Reflow furnace for an electronic assembly

Details Reflow furnace for an electronic assembly Reflow furnace for an electronic assembly

1999-09-21

2000-10-10

Ryan, Patrick

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

Including wiper

2281801, 228118, 228214, 228 19, 228 21, 432 4, 432 13, 432 34, 432 50, 432226, 4322541, 219393, 21945212, B23K 3706, F27B 940, F27D 312, F27D 500

Patent

active

061292567

ABSTRACT:
The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.

REFERENCES:
patent: 4533188 (1985-08-01), Miniet
patent: 5193735 (1993-03-01), Knight
patent: 5338008 (1994-08-01), Okumo et al.
patent: 5785233 (1998-07-01), Nutter et al.
patent: 5797539 (1998-08-01), Wilde et al.
patent: 5891606 (1999-04-01), Brown
patent: 5921462 (1999-07-01), Gordon
patent: 5934545 (1999-08-01), Gordon

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