Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2005-08-16
2005-08-16
Chaudhuri, Olik (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
Reexamination Certificate
active
06929969
ABSTRACT:
A method of fabricating a double substrate spatial light modulator wherein the mirror sidewall residue problem is eliminated is described. A first sacrificial layer is formed overlying a glass substrate. A metal layer is deposited overlying the first sacrificial layer. First openings are formed in the metal layer. A second sacrificial layer is formed overlying the metal layer and within the first openings. The second sacrificial layer is patterned to form hinge openings to the metal layer and the second and first sacrificial layers are patterned to form post openings to the substrate within the first openings. Support posts are formed within the post openings and hinges are formed within the hinge openings wherein each of the hinges is connected to the support posts on either side of the hinge openings. Thereafter, the metal layer is patterned to form a plurality of micromirrors wherein each of the plurality of micromirrors is attached on one end to one of the hinges through the hinge openings. The first and second sacrificial layers are removed to complete fabrication of the micromirrors.
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Chang Yuh-Hwa
Tzeng Jiann-Tyng
Chaudhuri Olik
Malsawma Lex H.
Taiwan Semiconductor Manufacturing Company
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