Reduction of subsurface damage in the production of bulk SiC...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

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C117S084000, C117S100000, C117S109000

Reexamination Certificate

active

10990607

ABSTRACT:
The invention is an improvement in a method of producing a high quality bulk single crystal of silicon carbide in a seeded sublimation system. The improvement includes etching the front face on each of a first and second SiC seed to a depth of greater than about 20 μm while protecting the opposite or back face on each of the first and second SiC seeds. Protection of the front faces occurs by placing the faces sufficiently close to one another to shield the back faces from being etched during etching of the respective unprotected front faces. Separation of the first and second SiC seeds occurs after the etching of the front faces is complete.

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Sterling B. Hicks, Screw Dislocations and Charge Balance as Factors of Crystal Growth, American Mineralogist, vol. 40, pp. 139-146, 1955.
D. Chaussende et al., Vapour-Liquid-Solid Mechanism for the Growth of SiC Homoepitaxial Layers by VPE, Journal of Crystal Growth, vol. 234, pp. 63-69, 2002.

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