Reduction of particle deposition on substrates using temperature

Details Reduction of particle deposition on substrates using temperature Reduction of particle deposition on substrates using temperature

1995-09-29

2000-08-29

Geist, Gary

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

438909, 438935, 437225, 437228, H01L 21302, H01L 21465

Patent

active

061108448

ABSTRACT:
A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.

REFERENCES:
patent: 5061444 (1991-10-01), Nazaroff et al.
patent: 5158690 (1992-10-01), Batchelder et al.
patent: 5356476 (1994-10-01), Foster et al.
patent: 5373806 (1994-12-01), Logar

Affiliated with

Also associated with

Rating

Reduction of particle deposition on substrates using temperature does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reduction of particle deposition on substrates using temperature, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduction of particle deposition on substrates using temperature will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1249630