Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1997-08-25
1999-08-17
Chaudhuri, Olik
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438143, H01L 2100
Patent
active
059407352
ABSTRACT:
A semiconductor device formed in a semiconductor substrate with a low hydrogen content barrier layer formed over the semiconductor device. The barrier layer is implanted with phosphorus ions. The semiconductor device may have a hydrogen getter layer formed under the barrier layer. The barrier layer is a high temperature PECVD nitride film, a high temperature PECVD oxynitride film or a high temperature LPCVD nitride film. The hydrogen getter layer is P-doped film having a thickness between 1000 and 2000 Angstroms and is a PSG, BPSG, PTEOS deposited oxide film, or BPTEOS deposited oxide film. Interconnects are made by a tungsten damascene process.
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R.C.Sun, J.T. Clemens and J.T.Nelson, "Effects of Silicon Nitride Encapsulation of MOS Device Stablilty," 1980 IEEE.
J. Givens, S. Geissler, O.Cain, W.Clark, C. Koburger, J.Lee, "A Low-Temperature Local Interconnect Process in a 0.25-micrometer-Channel CMOS Logic Technology with Shallow Trench Isolation," Jun. 7-8, 1994 VMIC Conference 1994 ISMIC-103/94/0043.
Mehta Sunil D.
Ng Che-Hoo
Advanced Micro Devices , Inc.
Chaudhuri Olik
Mai Anh D.
Nelson H. Donald
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