Reducing polishing pad deformation

Details Reducing polishing pad deformation Reducing polishing pad deformation

2007-03-07

2009-11-24

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S527000

Reexamination Certificate

active

07621798

ABSTRACT:
A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.

REFERENCES:
patent: 6248000 (2001-06-01), Aiyer
patent: 6254459 (2001-07-01), Bajaj et al.
patent: 7118457 (2006-10-01), Swedek et al.
patent: 2003/0148721 (2003-08-01), Birang et al.
patent: 2003/0236055 (2003-12-01), Swedek et al.
patent: 2005/0136800 (2005-06-01), Miller et al.

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