Reducing particulates during semiconductor fabrication

Details Reducing particulates during semiconductor fabrication Reducing particulates during semiconductor fabrication

1991-10-24

1992-07-21

Schwadron, Martin P.

Heat exchange

With retainer for removable article

Electrical component

165 803, 437228, 437248, 29 2502, 118 50, F28F 700, H01L 2158, C23C 1422

Patent

active

051314606

ABSTRACT:
A system for pumping down pressurized gas residing after shut-off in the piping use to provide a gas flow to facilitate backside wafer heating/cooling during the processing of a semiconductor wafer and including a valve selectable secondary piping line for equalizing on shutoff any pressure differential occurring in the primary gas flow line between the process chamber and the backside heating element. The secondary line runs from an opening in the process chamber wall to a tee-joint installed in the primary flow line immediately downstream of the final isolation valve in the primary line. A valve is installed in the secondary line and is operationally interlocked, in an inverse manner, with the isolation valve in the primary line such that when one valve is open the other valve is closed and vice versa.

REFERENCES:
patent: 4508161 (1985-04-01), Holden
patent: 4527620 (1985-07-01), Pedersen et al.
patent: 4671204 (1987-06-01), Ballou
patent: 4680061 (1987-07-01), Lamont, Jr.
patent: 4724621 (1988-02-01), Hobson et al.

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