Reducing mechanical resonance and improved distribution of...

Details Reducing mechanical resonance and improved distribution of... Reducing mechanical resonance and improved distribution of...

2005-08-16

2010-10-12

Wilkins, Harry (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S22400M

Reexamination Certificate

active

07811424

ABSTRACT:
An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.

REFERENCES:
patent: 6488040 (2002-12-01), de Larios et al.
patent: 6495005 (2002-12-01), Colgan et al.
patent: 6854473 (2005-02-01), Hanson et al.
patent: 2003/0146089 (2003-08-01), Basol
patent: 2004/0178060 (2004-09-01), Ravkin et al.

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