Reducing introduction of foreign material to wafers

Details Reducing introduction of foreign material to wafers Reducing introduction of foreign material to wafers

2011-03-08

2011-03-08

Smith, Duane (Department: 1776)

Gas separation: apparatus

Electric field separation apparatus

Collecting electrode details

C055S385100, C096S099000, C206S710000, C206S832000, C361S225000

Reexamination Certificate

active

07901490

ABSTRACT:
A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.

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