Reducing dusting of epoxy laminates

Details Reducing dusting of epoxy laminates Reducing dusting of epoxy laminates

2011-03-22

2011-03-22

Le, H. (Holly) T (Department: 1788)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C428S464000

Reexamination Certificate

active

07910202

ABSTRACT:
Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.

REFERENCES:
patent: 3426101 (1969-02-01), Ryan et al.
patent: 4152477 (1979-05-01), Haruta et al.
patent: 4264678 (1981-04-01), Nelsen et al.
patent: 4361616 (1982-11-01), Bomers
patent: 4375532 (1983-03-01), Baer
patent: 4770922 (1988-09-01), Hatakeyama et al.
patent: 5190814 (1993-03-01), Foster et al.
patent: 5216077 (1993-06-01), Yoshizumi et al.
patent: 5264065 (1993-11-01), Kohm
patent: 5356698 (1994-10-01), Kawamoto et al.
patent: 5409967 (1995-04-01), Carson et al.
patent: 6045898 (2000-04-01), Kishi et al.
patent: 6187852 (2001-02-01), Tungare et al.
patent: 7507471 (2009-03-01), Holte
Cardwell, et al., “Rate and Temperature Effects on the Fracture Toughness of a Rubber-Modified Epoxy”, Polymer, 1993, vol. 34, No. 8, pp. 1695-1701.

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