Reduced stress LOC assembly including cantilevered leads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads

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257691, H01L 2348

Patent

active

058723986

ABSTRACT:
An LOC die assembly including a die dielectrically adhered to the underside of a lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant is maximized, and the point stresses on the active surface caused by the filler particles are reduced by the lead flexure.

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