Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent
1996-01-11
1999-02-16
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
257691, H01L 2348
Patent
active
058723986
ABSTRACT:
An LOC die assembly including a die dielectrically adhered to the underside of a lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant is maximized, and the point stresses on the active surface caused by the filler particles are reduced by the lead flexure.
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Brooks Jerry M.
Corisis David J.
King Jerrold L.
Kinsman Larry D.
Chaudhuri Olik
Kelley Nat
Micro)n Technology, Inc.
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