Reduced pressure processing system and reduced pressure processi

Details Reduced pressure processing system and reduced pressure processi Reduced pressure processing system and reduced pressure processi

1994-01-28

1995-10-03

Padgett, Marianne

Coating processes

Spray coating utilizing flame or plasma heat

Silicon containing coating

427557, 4272481, 427294, B05D 306, C23C 1600

Patent

active

054550823

ABSTRACT:
A reduced pressure processing system includes a load lock chamber having an opening communicating with a process atmosphere in which a wafer is processed and/or the outer air atmosphere, a gate valve which is arranged at the opening to close/open the chamber with respect to the process atmosphere and/or the outer air atmosphere, a robot for loading/unloading the wafer into/from the chamber, an evacuation pump for evacuating the chamber, a heater for heating the wall of the chamber, and a controller for controlling the gate valve, the robot, the evacuation pump, and the heater.

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patent: 5322712 (1994-06-01), Norman et al.
J. F. O'Hanlon, A User's Guide to Vacuum Technology, pp. 252-275, 2nd edition, John Wiley & Sons, New York, 1989 (no month).

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