Reduced noise semiconductor package stack

Details Reduced noise semiconductor package stack Reduced noise semiconductor package stack

1995-06-07

1997-08-12

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 257723, 257777, H01L 2302, H01L 2348

Patent

active

056568568

ABSTRACT:
A semiconductor package stack assembly providing reduced electrical noise, in which a conductive film is provided on an exposed bottom surface of the semiconductor chip of each semiconductor package in a unitary stack thereof, each conductive film being grounded to ground lines of the printed circuit board on which the lowermost package of the stack is surface-mounted.

REFERENCES:
patent: 4945399 (1990-07-01), Brown et al.
patent: 4956694 (1990-09-01), Eide
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5237204 (1993-08-01), Val
patent: 5266912 (1993-11-01), Kledzik
patent: 5448106 (1995-09-01), Fujitsu

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