Rectilinearly deflectable element fabricated from a single wafer

Details Rectilinearly deflectable element fabricated from a single wafer Rectilinearly deflectable element fabricated from a single wafer

1987-12-21

1989-03-14

Levy, Stewart J.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 1566591, 156662, 7386264, 29 2541, H01L 21306

Patent

active

048121991

ABSTRACT:
A suspended element etched in a silicon substrate whcih is deflected in linear proportion to an applied force. A pair of flexing member symmetrically positioned around the suspended element provides rectilinear movement of the suspended element in response to the applied force. In one embodiment of the invention, the flexing member is formed in a single etchant step by concurrently etching nearly identical recesses into opposing planar surfaces of the silicon substrate. In this embodiment, the portions of silicon remaining between the recesses and planar surfaces define the flexing member.

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patent: 4342227 (1982-08-01), Petersen et al.
patent: 4586109 (1986-04-01), Peters et al.
patent: 4594639 (1986-06-01), Kuisma
patent: 4653326 (1987-03-01), Danel et al.
Kuan et al., "Two-Sided Groove Etching Method to Produce Silicon Ink Jet Nozzles", IBM Bulletin, vol. 21, No. 6, Nov. 1978.

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