Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-05-17
2011-05-17
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S124000, C438S127000, C257SE23116
Reexamination Certificate
active
07943423
ABSTRACT:
A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.
REFERENCES:
patent: 6326240 (2001-12-01), Liaw
patent: 6602734 (2003-08-01), Wada et al.
patent: 2006/0065964 (2006-03-01), Ohsumi
patent: 2006/0094161 (2006-05-01), Tao
Brunnbauer Markus
Fuergut Edward
Meyer Thorsten
Pohl Jens
Porwol Daniel
Dicke Billig & Czaja, PLLC
Garber Charles D
Infineon - Technologies AG
Patel Reema
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