Electronic digital logic circuitry – Multifunctional or programmable – Array
Reexamination Certificate
2007-10-16
2007-10-16
Chang, Daniel (Department: 2819)
Electronic digital logic circuitry
Multifunctional or programmable
Array
C326S038000, C257S686000, C257S723000, C257S777000
Reexamination Certificate
active
11383149
ABSTRACT:
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
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Guzy D. James
Huppenthal Jon M.
Arbor Company LLP
Chang Daniel
Hogan & Hartson LLP
Kubida William J.
Meza Peter J.
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