Recessed STI for wide transistors

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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Details

C438S437000, C438S702000, C257SE21429, C257SE21546

Reexamination Certificate

active

08058161

ABSTRACT:
A method of manufacturing a semiconductor device having shallow trench isolation includes steps of forming a hard mask layer on the substrate surface, etching a trench through the hard mask, filling the trench with an isolation material, forming a recessed trench, and forming a serpentine gate structure to connect electronic sources and drains.

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