Real time control of plasma etch utilizing multivariate statisti

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364148, 364552, 364164, 364468, 437 7, 437939, G06F 1546

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active

054793408

ABSTRACT:
Hotelling's T.sup.2 statistical analysis and control is used to provide multivariate analysis of components of an RF spectra for real time, in-situ control of an ongoing semiconductor process. An algorithm calculates the T.sup.2 value which is then used to generate a feedback signal, if the T.sup.2 value is out of range, to indicate an out-of-tolerance condition.

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patent: 5392226 (1995-02-01), Hamilton
1982-ASQC Quality Congress Transactions--Detroit, Multivariate Quality Control: State of the Art, Frank B. Alt, May 1982, pp. 886-893.
Technometrics, Quality Control Methods for Several Related Variables, J. Edward Jackson, vol. 1, No. 4, Nov. 1959, 359-377.
Encyclopedia of Statistical Sciences, vol. 6, Multivariate Analysis to Plackett and Burman Designs, Multivariate Quality Control, John Wiley & Sons, 1985, pp. 110-122.
Statistical Methods for Quality Improvement, Thomas P. Ryan, Chapter 9, Multivariate Control Charts for Measurement Data, John Wiley & Sons, Inc. 1989, pp. 215-229.

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