Reactive sputter cleaning of semiconductor wafer

Details Reactive sputter cleaning of semiconductor wafer Reactive sputter cleaning of semiconductor wafer

1985-01-31

1986-04-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29571, 134 1, 156646, 156657, 204192EC, 204192E, B44C 122, C03C 1500, C23C 1500, C03C 2506

Patent

active

045855170

ABSTRACT:
A method for cleaning semiconductor wafers prior to the sputter deposition of a metal is disclosed. Introducing a mixture of ninety percent argon and ten percent freon to a sputter deposition system to sputter etch the wafers thereby allowing for the removal of unwanted oxide.

REFERENCES:
patent: 3479269 (1969-11-01), Byrnes et al.
patent: 4056642 (1977-11-01), Saxena et al.
patent: 4328080 (1982-05-01), Harris
patent: 4488351 (1984-12-01), Momose

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