Reactive solder material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S704000, C257S706000, C257S781000, C257S783000, C438S118000, C438S119000, C438S122000

Reexamination Certificate

active

07436058

ABSTRACT:
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

REFERENCES:
patent: 3766977 (1973-10-01), Pravda et al.
patent: 3883946 (1975-05-01), Dale
patent: 3949118 (1976-04-01), Nagano et al.
patent: 4081825 (1978-03-01), Koopman et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 5387815 (1995-02-01), Nishiguchi
patent: 5396403 (1995-03-01), Patel
patent: 5532513 (1996-07-01), Smith et al.
patent: 5913104 (1999-06-01), Piper et al.
patent: 6047876 (2000-04-01), Smith
patent: 6133071 (2000-10-01), Nagai
patent: 6231693 (2001-05-01), Lugscheider et al.
patent: 6292367 (2001-09-01), Sikka et al.
patent: 6342407 (2002-01-01), Goldmann et al.
patent: 6361742 (2002-03-01), Takeda et al.
patent: 6437240 (2002-08-01), Smith
patent: 6461891 (2002-10-01), Dishongh et al.
patent: 6472762 (2002-10-01), Kutlu
patent: 6534859 (2003-03-01), Shim et al.
patent: 6706219 (2004-03-01), Nguyen
patent: 6767765 (2004-07-01), Chiu
patent: 6767819 (2004-07-01), Lutz
patent: 6773963 (2004-08-01), Houle
patent: 7042084 (2006-05-01), Takeuchi
patent: 7126218 (2006-10-01), Darveaux et al.
patent: 2001/0000321 (2001-04-01), Takeda et al.
patent: 2001/0013655 (2001-08-01), Smith
patent: 2001/0024724 (2001-09-01), McCullough
patent: 2001/0026957 (2001-10-01), Atwood et al.
patent: 2001/0032719 (2001-10-01), Kim et al.
patent: 2001/0038093 (2001-11-01), Nguen
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2002/0041036 (2002-04-01), Smith
patent: 2002/0106528 (2002-08-01), Jin et al.
patent: 2002/0141155 (2002-10-01), Pinneo
patent: 2002/0154485 (2002-10-01), Hill et al.
patent: 2003/0034557 (2003-02-01), Gupta et al.
patent: 2003/0077478 (2003-04-01), Dani et al.
patent: 2003/0127715 (2003-07-01), Liu et al.
patent: 2003/0134454 (2003-07-01), Houle
patent: 2003/0160319 (2003-08-01), Zheng et al.
patent: 2003/0173051 (2003-09-01), Rinella et al.
patent: 2003/0183909 (2003-10-01), Chiu
patent: 06-107471 (1994-04-01), None
PCT Search Report PCT/US 03/10485—mailed Apr. 27, 2004, 8 pages (citing four (4) U.S. Patents listed above).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reactive solder material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reactive solder material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive solder material will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4015014

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.