Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2002-05-09
2008-10-14
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S704000, C257S706000, C257S781000, C257S783000, C438S118000, C438S119000, C438S122000
Reexamination Certificate
active
07436058
ABSTRACT:
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.
REFERENCES:
patent: 3766977 (1973-10-01), Pravda et al.
patent: 3883946 (1975-05-01), Dale
patent: 3949118 (1976-04-01), Nagano et al.
patent: 4081825 (1978-03-01), Koopman et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 5387815 (1995-02-01), Nishiguchi
patent: 5396403 (1995-03-01), Patel
patent: 5532513 (1996-07-01), Smith et al.
patent: 5913104 (1999-06-01), Piper et al.
patent: 6047876 (2000-04-01), Smith
patent: 6133071 (2000-10-01), Nagai
patent: 6231693 (2001-05-01), Lugscheider et al.
patent: 6292367 (2001-09-01), Sikka et al.
patent: 6342407 (2002-01-01), Goldmann et al.
patent: 6361742 (2002-03-01), Takeda et al.
patent: 6437240 (2002-08-01), Smith
patent: 6461891 (2002-10-01), Dishongh et al.
patent: 6472762 (2002-10-01), Kutlu
patent: 6534859 (2003-03-01), Shim et al.
patent: 6706219 (2004-03-01), Nguyen
patent: 6767765 (2004-07-01), Chiu
patent: 6767819 (2004-07-01), Lutz
patent: 6773963 (2004-08-01), Houle
patent: 7042084 (2006-05-01), Takeuchi
patent: 7126218 (2006-10-01), Darveaux et al.
patent: 2001/0000321 (2001-04-01), Takeda et al.
patent: 2001/0013655 (2001-08-01), Smith
patent: 2001/0024724 (2001-09-01), McCullough
patent: 2001/0026957 (2001-10-01), Atwood et al.
patent: 2001/0032719 (2001-10-01), Kim et al.
patent: 2001/0038093 (2001-11-01), Nguen
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2002/0041036 (2002-04-01), Smith
patent: 2002/0106528 (2002-08-01), Jin et al.
patent: 2002/0141155 (2002-10-01), Pinneo
patent: 2002/0154485 (2002-10-01), Hill et al.
patent: 2003/0034557 (2003-02-01), Gupta et al.
patent: 2003/0077478 (2003-04-01), Dani et al.
patent: 2003/0127715 (2003-07-01), Liu et al.
patent: 2003/0134454 (2003-07-01), Houle
patent: 2003/0160319 (2003-08-01), Zheng et al.
patent: 2003/0173051 (2003-09-01), Rinella et al.
patent: 2003/0183909 (2003-10-01), Chiu
patent: 06-107471 (1994-04-01), None
PCT Search Report PCT/US 03/10485—mailed Apr. 27, 2004, 8 pages (citing four (4) U.S. Patents listed above).
Deppisch Carl L.
Hua Fay
Whittenburg Krista J.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Jr. Carl Whitehead
Mitchell James
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