Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-12-13
1984-09-18
Massie, Jerome
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29591, 156656, 156657, 156662, 204192E, 357 67, H01L 21308
Patent
active
044722370
ABSTRACT:
A method for fabricating a device which includes a tantalum silicide structure, and which is essentially free of conductive etch residues, is disclosed. The method includes the steps of depositing tantalum and silicon onto a substrate, patterning the tantalum and silicon, and then sintering the patterned tantalum and silicon to form a patterned layer of tantalum silicide.
REFERENCES:
patent: 3795557 (1974-03-01), Jacob
patent: 4069096 (1978-01-01), Reinberg et al.
patent: 4128670 (1978-12-01), Gaensslen
patent: 4253907 (1981-03-01), Parry et al.
patent: 4285761 (1981-08-01), Fatula et al.
patent: 4352724 (1982-10-01), Sugishima et al.
patent: 4362597 (1982-12-01), Fraser et al.
patent: 4414057 (1983-11-01), Bourssa et al.
patent: 4436582 (1984-03-01), Saxena
Tsang, "Forming . . . Barrier", IBM Technical Disclosure Bull., vol. 19, No. 9, (2/77), pp. 3383-3385.
Howard et al., "Refractory . . . Structures", IBM Technical Disclosure Bull., vol. 23, No. 7B, (12/80), pp. 3220-3221.
Bennett et al., "Process . . . Ion Etching", IBM Technical Disclosure Bulletin, vol. 24, No. 6, (11/81), p. 2857.
Bhattacharya, "System . . . Etching", IBM Technical Disclosure Bulletin, vol. 20, No. 3, (8/77), p. 99.
Gdula et al., "Method . . . Mouseholing", IBM Technical Disclosure Bulletin, vol. 21, No. 6, (11/78), pp. 2327-2328.
Deslauriers Jean S.
Levinstein Hyman J.
AT&T Bell Laboratories
Massie Jerome
Schneider Bruce S.
Tiegerman Bernard
LandOfFree
Reactive ion etching of tantalum and silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reactive ion etching of tantalum and silicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive ion etching of tantalum and silicon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-792585