Reactive ion etching of tantalum and silicon

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29591, 156656, 156657, 156662, 204192E, 357 67, H01L 21308

Patent

active

044722370

ABSTRACT:
A method for fabricating a device which includes a tantalum silicide structure, and which is essentially free of conductive etch residues, is disclosed. The method includes the steps of depositing tantalum and silicon onto a substrate, patterning the tantalum and silicon, and then sintering the patterned tantalum and silicon to form a patterned layer of tantalum silicide.

REFERENCES:
patent: 3795557 (1974-03-01), Jacob
patent: 4069096 (1978-01-01), Reinberg et al.
patent: 4128670 (1978-12-01), Gaensslen
patent: 4253907 (1981-03-01), Parry et al.
patent: 4285761 (1981-08-01), Fatula et al.
patent: 4352724 (1982-10-01), Sugishima et al.
patent: 4362597 (1982-12-01), Fraser et al.
patent: 4414057 (1983-11-01), Bourssa et al.
patent: 4436582 (1984-03-01), Saxena
Tsang, "Forming . . . Barrier", IBM Technical Disclosure Bull., vol. 19, No. 9, (2/77), pp. 3383-3385.
Howard et al., "Refractory . . . Structures", IBM Technical Disclosure Bull., vol. 23, No. 7B, (12/80), pp. 3220-3221.
Bennett et al., "Process . . . Ion Etching", IBM Technical Disclosure Bulletin, vol. 24, No. 6, (11/81), p. 2857.
Bhattacharya, "System . . . Etching", IBM Technical Disclosure Bulletin, vol. 20, No. 3, (8/77), p. 99.
Gdula et al., "Method . . . Mouseholing", IBM Technical Disclosure Bulletin, vol. 21, No. 6, (11/78), pp. 2327-2328.

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