Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-07-11
1991-04-16
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156657, 1566591, 156662, H01L 21306, B44C 122
Patent
active
050079824
ABSTRACT:
A plasma etching process using HBr is set forth in which etching of silicon and polysilicon in IC manufacture is significantly improved by the high etching selectivity for either silicon and polysilicon to both oxides and photoresist materials.
REFERENCES:
patent: 4432132 (1984-02-01), Kinsbron et al.
patent: 4490209 (1984-12-01), Hartman
patent: 4778563 (1988-10-01), Stone
patent: 4784720 (1988-11-01), Douglas
Dang Thi
Miller Paul R.
North American Philips Corporation
Simmons David A.
LandOfFree
Reactive ion etching of silicon with hydrogen bromide does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reactive ion etching of silicon with hydrogen bromide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive ion etching of silicon with hydrogen bromide will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-419450