Reactive ion etching of silicon with hydrogen bromide

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156646, 156657, 1566591, 156662, H01L 21306, B44C 122

Patent

active

050079824

ABSTRACT:
A plasma etching process using HBr is set forth in which etching of silicon and polysilicon in IC manufacture is significantly improved by the high etching selectivity for either silicon and polysilicon to both oxides and photoresist materials.

REFERENCES:
patent: 4432132 (1984-02-01), Kinsbron et al.
patent: 4490209 (1984-12-01), Hartman
patent: 4778563 (1988-10-01), Stone
patent: 4784720 (1988-11-01), Douglas

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reactive ion etching of silicon with hydrogen bromide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reactive ion etching of silicon with hydrogen bromide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive ion etching of silicon with hydrogen bromide will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-419450

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.