Reactive ion etching

Details Reactive ion etching Reactive ion etching

1979-08-17

1981-08-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156345, 204192E, H01L 21306, B44C 122, C23F 100

Patent

active

042832497

ABSTRACT:
A silicon oxide, nitride, and/or oxynitride surface on a substrate is selectively etched at a rate greater than that of the substrate by a reactive ion etching employing a gaseous mixture containing a fluorocarbon and a second gas capable of supplying hydrogen.

REFERENCES:
patent: 3654108 (1972-04-01), Smith
patent: 3940506 (1976-02-01), Heinecke
patent: 3971684 (1976-07-01), Muto
patent: 4028155 (1977-06-01), Jacob

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