Raw card fabrication process with nickel overplate

Details Raw card fabrication process with nickel overplate Raw card fabrication process with nickel overplate

1986-10-31

1988-07-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156151, 156656, 1566591, 156666, 156902, 204 384, 427 96, 427 97, 428137, 428601, 428901, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047567953

ABSTRACT:
A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.

REFERENCES:
patent: 3679381 (1972-07-01), Chessin
patent: 3936548 (1976-02-01), Konicek
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4325780 (1982-04-01), Schulz et al.
patent: 4514586 (1985-04-01), Waggoner
patent: 4568413 (1986-02-01), Toth et al.
patent: 4605471 (1986-08-01), Mitchell

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