Rapid and selective heating method in integrated circuit package

Details Rapid and selective heating method in integrated circuit package Rapid and selective heating method in integrated circuit package

1997-12-16

2000-03-28

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

2281805, 2282341, 219220, 219553, B23K 3700, B23K 3102, H05B 100, H05B 310

Patent

active

060419946

ABSTRACT:
A method and apparatus for selectively heating a structure (20) capable of absorbing heat radiations in the 0.5 to 2 micron range relative to an adjacent structure (24) wherein a first structure capable of absorbing heat radiations in the 0.5 to 2 micron range is disposed adjacent a second structure much less capable of absorbing heat radiations in the 0.5 to 2 micron range. An unfocused heat source (28) which provides a major portion of its heat energy in the range of from about 0.5.mu. to about 2.mu. relative to heat energy above 2.mu. and below 0.5 micron directs heat concurrently to the first and second structures to heat the first structure to a temperature sufficiently high and much higher then the second structure to permit a predetermined function to be performed in conjunction with the first structure while maintaining the second structure below a predetermined temperature. The function is then performed. The heat source preferably comprises an unfocused tungsten halogen lamp.

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