Radiofrequency power semiconductor module with cavity...

Details Radiofrequency power semiconductor module with cavity... Radiofrequency power semiconductor module with cavity...

2003-05-22

2008-08-26

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S548000, C257S704000, C257S676000, C257S713000, C257S723000, C257S690000, C257S698000

Reexamination Certificate

active

07417198

ABSTRACT:
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

REFERENCES:
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4246697 (1981-01-01), Smith
patent: 4762983 (1988-08-01), Oogita et al.
patent: 5070390 (1991-12-01), Shimizu
patent: 5458716 (1995-10-01), Alfaro et al.
patent: 5466969 (1995-11-01), Tsunoda
patent: 5661343 (1997-08-01), Takahashi et al.
patent: 6212087 (2001-04-01), Grant et al.
patent: 2003/0076659 (2003-04-01), Ichitsubo et al.
patent: 3616969 (1987-11-01), None
patent: 19530577 (1997-02-01), None
patent: 19509441 (1997-08-01), None
patent: 0563969 (1997-09-01), None
patent: 2174538 (1986-11-01), None
patent: 03093290 (1991-04-01), None
patent: 04284650 (1992-09-01), None
patent: 95/15007 (1995-06-01), None
patent: 97/07540 (1997-02-01), None

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