Radio frequency power semiconductor device package...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE29120, C257SE29122

Reexamination Certificate

active

07898057

ABSTRACT:
A power transistor includes a plurality of transistor cells. Each transistor cell has a first electrode coupled to a first electrode interconnection region overlying a first major surface, a control electrode coupled to a control electrode interconnection region overlying the first major surface, and a second electrode coupled to a second electrode interconnection region overlying a second major surface. Each transistor cell has an approximately constant doping concentration in the channel region. A dielectric platform is used as an edge termination of an epitaxial layer to maintain substantially planar equipotential lines therein. The power transistor finds particular utility in radio frequency applications operating at a frequency greater than 500 megahertz and dissipating more than 5 watts of power. The semiconductor die and package are designed so that the power transistor can efficiently operate under such severe conditions.

REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 4710794 (1987-12-01), Koshino et al.
patent: 4960723 (1990-10-01), Davies
patent: 5008736 (1991-04-01), Davies et al.
patent: 5032878 (1991-07-01), Davies et al.
patent: 5075739 (1991-12-01), Davies
patent: 5075759 (1991-12-01), Moline
patent: 5252848 (1993-10-01), Adler et al.
patent: 5254491 (1993-10-01), Boland et al.
patent: 5281839 (1994-01-01), Cambou et al.
patent: 5372960 (1994-12-01), Davies et al.
patent: 5510648 (1996-04-01), Davies et al.
patent: 5519250 (1996-05-01), Numata
patent: 5541132 (1996-07-01), Davies et al.
patent: 5563437 (1996-10-01), Davies et al.
patent: 5612244 (1997-03-01), Davies et al.
patent: 5640041 (1997-06-01), Lur et al.
patent: 5641712 (1997-06-01), Grivna et al.
patent: 5652452 (1997-07-01), Asano
patent: 5688700 (1997-11-01), Kao et al.
patent: 5780324 (1998-07-01), Tokura et al.
patent: 5792706 (1998-08-01), Michael et al.
patent: 5814859 (1998-09-01), Ghezzo et al.
patent: 5846849 (1998-12-01), Shaw et al.
patent: 6033231 (2000-03-01), Davies et al.
patent: 6084269 (2000-07-01), Davies et al.
patent: 6118171 (2000-09-01), Davies et al.
patent: 6180995 (2001-01-01), Hebert
patent: 6197640 (2001-03-01), Davies
patent: 6251734 (2001-06-01), Grivna et al.
patent: 6261892 (2001-07-01), Swanson
patent: 6271106 (2001-08-01), Grivna et al.
patent: 6307247 (2001-10-01), Davies
patent: 6348712 (2002-02-01), Korec et al.
patent: 6410958 (2002-06-01), Usui et al.
patent: 6455393 (2002-09-01), Swanson
patent: 6455925 (2002-09-01), Laureanti
patent: 6465276 (2002-10-01), Kuo
patent: 6489652 (2002-12-01), Jeon et al.
patent: 6498069 (2002-12-01), Grivna
patent: 6503838 (2003-01-01), Swanson
patent: 6512283 (2003-01-01), Davies
patent: 6531376 (2003-03-01), Cai et al.
patent: 6566749 (2003-05-01), Joshi et al.
patent: 6586833 (2003-07-01), Baliga
patent: 6617252 (2003-09-01), Davies
patent: 6617686 (2003-09-01), Davies
patent: 6621136 (2003-09-01), Grivna
patent: 6653691 (2003-11-01), Baliga
patent: 6661068 (2003-12-01), Durham et al.
patent: 6674157 (2004-01-01), Lang
patent: 6727117 (2004-04-01), McCoy
patent: 6740931 (2004-05-01), Kouzuki et al.
patent: 6758746 (2004-07-01), Hunter et al.
patent: 6759746 (2004-07-01), Davies
patent: 6764918 (2004-07-01), Loechelt
patent: 6784366 (2004-08-01), Boucher et al.
patent: 6803317 (2004-10-01), Grivna
patent: 6809396 (2004-10-01), Zdebel et al.
patent: 6870219 (2005-03-01), Brech
patent: 6939788 (2005-09-01), Davies
patent: 6984860 (2006-01-01), Grivna et al.
patent: 7019358 (2006-03-01), Amato
patent: 7078784 (2006-07-01), Davies
patent: 7087925 (2006-08-01), Grivna
patent: 7126426 (2006-10-01), Mishra et al.
patent: 7148533 (2006-12-01), Hsu et al.
patent: 7148553 (2006-12-01), Davies
patent: 7176524 (2007-02-01), Loechelt et al.
patent: 7202152 (2007-04-01), Davies
patent: 7253477 (2007-08-01), Loechelt et al.
patent: 7256119 (2007-08-01), Grivna et al.
patent: 7282406 (2007-10-01), Grivna et al.
patent: 7285823 (2007-10-01), Loechelt et al.
patent: 7300850 (2007-11-01), Grivna
patent: 7446003 (2008-11-01), Moscatelli et al.
patent: 7452796 (2008-11-01), Davies
patent: 7462550 (2008-12-01), Grivna
patent: 7482220 (2009-01-01), Loechelt et al.
patent: 2001/0044167 (2001-11-01), Kuo
patent: 2002/0063259 (2002-05-01), Usui et al.
patent: 2002/0130362 (2002-09-01), Park
patent: 2002/0167044 (2002-11-01), Weber
patent: 2003/0136984 (2003-07-01), Masuda et al.
patent: 2004/0099896 (2004-05-01), Zdebel et al.
patent: 2004/0217443 (2004-11-01), Davies
patent: 2006/0180858 (2006-08-01), Loechelt et al.
patent: 2006/0226451 (2006-10-01), Davies
patent: 2006/0226498 (2006-10-01), Davies
patent: 2006/0246652 (2006-11-01), Grivna et al.
patent: 2007/0034947 (2007-02-01), Loechelt et al.
patent: 2007/0057289 (2007-03-01), Davies
patent: 2007/0075399 (2007-04-01), Grivna
patent: 2007/0093077 (2007-04-01), Grivna
patent: 2007/0148947 (2007-06-01), Davies
patent: 2007/0207582 (2007-09-01), Grivna et al.
patent: 2010/0032750 (2010-02-01), Davies
patent: 54-044481 (1979-04-01), None
patent: 61-184843 (1986-08-01), None
patent: 04-264776 (1992-09-01), None
patent: 06-334503 (1994-12-01), None
patent: 2001-127292 (2001-05-01), None
patent: 2002-164540 (2002-06-01), None
patent: 2002-203964 (2002-07-01), None
patent: 2003-309261 (2003-10-01), None
patent: 2006310836 (2006-11-01), None
patent: 2006310837 (2006-11-01), None
patent: 2006310838 (2006-11-01), None
patent: 2007505505 (2007-03-01), None
patent: 2005069378 (2005-07-01), None
Adamson, Philip , “Lead-free Packaging for Discrete Power Semiconductors”,International IOR Rectifier- as presented at the 2002 JEDEC Conference, (Apr./May 2002), 5 pages.
Burns, Lawrence M., “Applications for GaAs and Silicon Integrated Circuits in Next Generation Wireless Communication Systems”,IEEE Journal of Solid-State Circuits, vol. 30, No. 10, (Oct. 1995), 1088-1095.
Bussarakons, Tiva , “New Materials and Technologies Solve Hermetic SMD Integration”,International IOR Rectifier- as appeared in PCIM Power Electronic Systems Magazine, (Dec. 1999), 5 pages.
Craninckx, Jan , et al., “A 1.8-GHz Low-Phase-Noise Spiral-LC CMOS VCO”,1996 IEEE: 1996 Symposium on VLSI Circuits Digest of Technical Papers, (1996), 30-31.
Erzgraber, H.B. , et al., “A Novel Buried Oxide Isolation for Monolithic RF Inductors on Silicon”,IEDM 98-535, IEEE 1998, (1998), 535-539.
Hartung, Jurgen , “Integrated Passive Components in MCM-Si Technology and their Applications in RF-Systems”,1998 International Conference on Multichip Modules and High Density Packaging, (1998), 256-261.
Juhel, S. , et al., “PowerSO-10RF: The First True RF Power SMD Package”,AN1294 Application Note, (Feb. 2001), 12 pages.
Mahalingam, Mali , et al., “Low Rth Device Packaging for High Power RF LDMOS Transistors for Cellular and 3G Base Station Use”,Freescale Semiconductor, Inc., Motorola Inc. 2003, (2003), 4 pages.
Niknejad, Ali M., et al., “Analysis, Design, and Optimization of Spiral Inductors and Transformers for Si RF IC's”,IEEE Journal of Solid-State Curcuits, vol. 33, No. 10, (Oct. 1998),1470-1481.
Prophet, Graham , “Power FETs find their place”,EDN, (Apr. 17, 2003), 6 pages.
Radivojevic, Z. , et al., “Novel Material for Improved Quality of RF-PA in Base-Station Applications”,Presented at 10th International Workshop on Thermal Investigations of ICs and Systems, Co-Authored by Nokia Research Center and Freescale Semiconductor,(Sep./Oct. 2004), 7 pages.
Sawle, Andrew , et al., “DirectEFT—A Proprietary New Source Mounted Power Package for Board Mounted Power”, http://www.irf.com/technical-info/whitepaper/directfet.pdf, (Unknown), 5 pages.
Office Action for U.S. Appl. No. 10/557,135, mailed on May 13, 2009, 13 pages.
Office Action for U.S. Appl. No. 10/557,135, mailed on Jul. 24, 2008, 12 pages.
Notice of Allowance for U.S. Appl. No. 10/557,135, mailed on Aug. 24, 2009, 9 pages.
Office Action for U.S. Appl. No. 11/387,209, mailed on Jan. 23, 2009, 18 pages.
Office Action for U.S. Appl. No. 11/3

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radio frequency power semiconductor device package... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radio frequency power semiconductor device package..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radio frequency power semiconductor device package... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2645835

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.