1991-03-14
1992-09-22
Epps, Georgia Y.
357 72, 357 73, 357 74, 357 80, H01L 2302
Patent
active
051501988
ABSTRACT:
A radiator for a semiconductor chip is provided which is made from a material having good heat conductivity. The radiator is plate shaped and is attached to the semiconductor chip. The radiator has at least one projection on the outer peripheral edge thereof so as to extend outwardly, laterally beyond the outer periphery of the semiconductor chip. The semiconductor chip and the radiator are sealed within plastic so that the projection of the radiator extend outwardly from the plastic encapsulation. Heat from the semiconductor chip is released from the plastic encapsulation via the projection(s) of the radiator. The radiator can be formed from a material which also has good electrical conductivity to electrically protect the semiconductor chip.
REFERENCES:
patent: 4943844 (1990-07-01), Oscilowski et al.
patent: 4953173 (1990-08-01), Fujitsu
Konda Masashi
Ohikata Naoharu
Yamamoto Toshio
Epps Georgia Y.
Nippon Steel Corporation
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