Radiation stress relieving of sulfone polymer articles

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29852, 156 83, 1562722, 156280, 156630, 156643, 156645, 156668, 156902, 174 685, 264 22, 427 451, 427 97, 427307, 428131, 428137, 428901, B44C 122, C03C 1500, C03C 2506, C23F 102

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active

043393039

ABSTRACT:
A method of rapidly relieving stress in an article comprised of a sulfone polymer is disclosed. The method can be used in the preparation of printed circuit boards. An article comprised of a sulfone polymer is exposed to electromagnetic radiation, for a time period sufficient to absorb enough energy to stress relieve the sulfone polymer against stress cracking therein. Exposure occurs at one or more ranges of frequencies which are capable of being absorbed by the sulfone polymer and which are effective for stress relieving without or substantially without causing heat induced softening or flowing of the sulfone polymer. The electromagnetic radiation is selected from the ranges of infrared, microwave and ultraviolet radiation.

REFERENCES:
patent: 3515615 (1970-06-01), Okada et al.
patent: 3930963 (1976-01-01), Polichette
patent: 4163725 (1979-08-01), Sano et al.
Technology Letter, No. 106, Polysulfones as Printed Circuit Substrates by Union Carbide Corp., Chemical and Plastics Division, May 4, 1977, pp. 1, 3, 5, 7, 8, 10 & 12.
Take a Fresh Look at Plastics for Circuit Boards by G. F. Jacky, Nov. 7, 1975, National Plated Printed Circuits Conference of Sep. 29-30, 1975, pp. 1-19.
Modern Plastics, Jun. 1975, pp. 52-54, New Day Draws for Circuit Boards.
Plastics Engineering, vol. 33, No. 2, Feb. 1977, Polysulfone Coming on Strong For Electrical Applications by R. M. Eichhorn.
Technology Letter, No. 101, Sep. 22, 1976, The Radiation Response of UDEL.RTM. Polysulfone by Union Carbide Corp.

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