Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2003-11-19
2010-10-26
Kelly, Cynthia H (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000
Reexamination Certificate
active
07820355
ABSTRACT:
A radiation sensitive resin composition which contains an alicyclic olefin resin obtained by ring-opening polymerization of a polymerizable monomer containing an alicyclic olefin monomer having carboxyl group using a ruthenium catalyst, followed by hydrogenation, an acid-generating agent, a crosslinking agent and a solvent; and a transparent resin pattern film formed on a substrate obtained by laminating a resin film formed by using the resin composition described above to the substrate, followed by irradiation with an active radiation to form a latent pattern and developing the pattern by bringing the resin film having the latent pattern into contact with a developing solution. The resin composition exhibits excellent property for development and storage stability. The transparent resin pattern film obtained from the resin composition exhibits excellent specific permittivity, transparency, dimensional stability under heating, solvent resistance and flatness and can be utilized as the resin film for electronic parts.
REFERENCES:
patent: 5350660 (1994-09-01), Urano et al.
patent: 5721990 (1998-02-01), Akaiwa et al.
patent: 6147177 (2000-11-01), Jayaraman et al.
patent: 6245485 (2001-06-01), Aoai et al.
patent: 6372403 (2002-04-01), Kurisaki et al.
patent: 6372854 (2002-04-01), Sunaga et al.
patent: 6451499 (2002-09-01), Jayaraman et al.
patent: 6486264 (2002-11-01), Tsunogae et al.
patent: 6692887 (2004-02-01), Suwa et al.
patent: 6696219 (2004-02-01), Yasunami et al.
patent: 6727032 (2004-04-01), Suwa et al.
patent: 6790582 (2004-09-01), Eilbeck
patent: 2002/0001772 (2002-01-01), Nishi et al.
patent: 2002/0012880 (2002-01-01), Imai et al.
patent: 2002/0128408 (2002-09-01), Goodall et al.
patent: 2002/0150825 (2002-10-01), Watanabe et al.
patent: 2003/0195357 (2003-10-01), Stuer et al.
patent: 2004/0152843 (2004-08-01), Taguchi et al.
patent: 1291302 (2001-04-01), None
patent: 0 440 374 (1991-08-01), None
patent: 7-2929 (1995-01-01), None
patent: 7-149823 (1995-06-01), None
patent: 10-307388 (1998-11-01), None
patent: 11-52574 (1999-02-01), None
patent: 11-158256 (1999-06-01), None
patent: 11-193323 (1999-07-01), None
patent: 11-209460 (1999-08-01), None
patent: 11-327144 (1999-11-01), None
patent: 3090991 (2000-07-01), None
patent: WO 99/42502 (1999-08-01), None
patent: WO 00/73366 (2000-12-01), None
patent: WO-02/14336 (2002-02-01), None
Birch & Stewart Kolasch & Birch, LLP
Eoff Anca
Kelly Cynthia H
Zeon Corporation
LandOfFree
Radiation sensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation sensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation sensitive resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4211976