Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1994-06-06
1995-02-28
Dote, Janis L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430296, 430325, 430914, 430921, 430925, 430942, 522 31, 522 59, 522148, G03F 7038
Patent
active
053936418
ABSTRACT:
A novel radiation-sensitive resin composition having high sensitivity and high O.sub.2 -RIE resistance is otained by blending 0.5 g of poly(di-t-butoxysiloxane), 50 mg of triphenylsulfonium trifluoromethanesulfonate as acid-producing agent, and 4 ml of 2-methoxyethyl acetate as solvent.
REFERENCES:
patent: 5120629 (1992-06-01), Bauer et al.
patent: 5135838 (1992-08-01), Houlihan et al.
PTO-English-Translation of Japanese Patent 60-186570 Pub Data Sep. 24, 1985.
"Complex Triarylsulfonium Salt Photoinitiators. I. The Identification Characterization, and Synthesis of a New Class . . . " J. V. Crivello et al., Journal of Polymer Sci.: Polymer Chemistry Edition, vol. 18, 2677-2695 (1980).
"Photoinitiation of Cationic Polymerization. II. Laser Flash Photolysis of Diphenyliodonium Salts", S. Peter Pappas, et al., Journal of Polymer Sci.: Polymer Chemistry Ed., vol. 22 69-76 (1984).
Ito Toshio
Sakata Miwa
Dote Janis L.
OKI Electric Industry Co., Ltd.
LandOfFree
Radiation-sensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation-sensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation-sensitive resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-847729