Radiation sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C522S111000, C522S148000, C522S059000

Reexamination Certificate

active

10975052

ABSTRACT:
A radiation-sensitive resin composition comprising (A) a resin containing a structural unit of the following formula (I), (B) a resin containing a recurring unit of the following formula (II), and (C) a photoacid generator,wherein R1represents a substituted or unsubstituted divalent (alicyclic) hydrocarbon, R2represents a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group, or any two R2s form in combination a divalent (substituted) alicyclic hydrocarbon group, with the remaining R2being a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group,wherein R3represents a hydrogen atom, fluorine atom, or trifluoromethyl group, R4represents a (substituted) hydrocarbon group with a valence of (c+1), (substituted) alicyclic hydrocarbon with a valence of (c+1), or (substituted) aromatic group with a valence of (c+1), R5represents a hydrogen atom or a monovalent acid-dissociable group, a and b individually represent an integer of 0-3, provided that (a+b)≧1 is satisfied, and c is an integer of 1-3. The radiation-sensitive resin composition has a high transparency at a wavelength of 193 nm or less and is particularly excellent in LER.

REFERENCES:
patent: 4910122 (1990-03-01), Arnold et al.
patent: 5215857 (1993-06-01), Hosaka et al.
patent: 5238774 (1993-08-01), Hosaka et al.
patent: 5405720 (1995-04-01), Hosaka et al.
patent: 5925492 (1999-07-01), Hosaka et al.
patent: 6020104 (2000-02-01), Hosaka et al.
patent: 6146793 (2000-11-01), Schaedeli et al.
patent: 6165682 (2000-12-01), Foster et al.
patent: 6207728 (2001-03-01), Sekiguchi et al.
patent: RE37179 (2001-05-01), Yamachika et al.
patent: 6228554 (2001-05-01), Hosaka et al.
patent: 6270939 (2001-08-01), Hosaka et al.
patent: 6280900 (2001-08-01), Chiba et al.
patent: 6337171 (2002-01-01), Kobayashi et al.
patent: 6403280 (2002-06-01), Yamahara et al.
patent: 6482568 (2002-11-01), Douki et al.
patent: 6506537 (2003-01-01), Kobayashi et al.
patent: 6531260 (2003-03-01), Iwasawa et al.
patent: 6623907 (2003-09-01), Numata et al.
patent: 6692887 (2004-02-01), Suwa et al.
patent: 6727032 (2004-04-01), Suwa et al.
patent: 6753124 (2004-06-01), Nishimura et al.
patent: 6800414 (2004-10-01), Nishimura et al.
patent: 6800419 (2004-10-01), Soyano et al.
patent: 6821705 (2004-11-01), Nagai et al.
patent: 6830870 (2004-12-01), Malik et al.
patent: 6838225 (2005-01-01), Nishimura et al.
patent: 6899989 (2005-05-01), Suzuki et al.
patent: 6933094 (2005-08-01), Miyaji et al.
patent: 6964840 (2005-11-01), Nishimura et al.
patent: 7108955 (2006-09-01), Iwasawa et al.
patent: 2003/0170561 (2003-09-01), Iwasawa et al.
patent: 2003/0203309 (2003-10-01), Nishimura et al.
patent: 2003/0219680 (2003-11-01), Nishimura et al.
patent: 2004/0048192 (2004-03-01), Shima et al.
patent: 2004/0072094 (2004-04-01), Shima et al.
patent: 2004/0143082 (2004-07-01), Iwasawa et al.
patent: 2004/0146802 (2004-07-01), Yamamoto et al.
patent: 2005/0095527 (2005-05-01), Yokoyama et al.
patent: 2005/0158657 (2005-07-01), Suzuki et al.
patent: 2005/0171226 (2005-08-01), Nishimura et al.
patent: 2005/0214680 (2005-09-01), Miyaji et al.
patent: 1 679 314 (2006-12-01), None
patent: 5-188598 (1993-07-01), None
patent: 5-323611 (1993-12-01), None
patent: 8-160623 (1996-06-01), None
patent: 11-60733 (1999-03-01), None
patent: 2000-221685 (2000-08-01), None
patent: 2000-221686 (2000-08-01), None
Jung et al., 1999,J. Photopolym. Sci. Technol., 12(4):561-570, “ArF Single Layer Resist Composed of Alicyclic Main Chain Containing Anhydride”.
Kunz et al., 1999,SPIE, 3678:13-23, “Outlook for 157-nm Resist Design”.
Kunz et al.,J. Photopolym. Sci. Technol., 12(4): 561-569, 1999 “Outlook for 157-nm Resist Design”.

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