Radiation-sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S286100, C430S905000, C430S910000

Reexamination Certificate

active

07005230

ABSTRACT:
A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays

REFERENCES:
patent: 2001/0023050 (2001-09-01), Numata et al.
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2002/0132181 (2002-09-01), Nishimura et al.
patent: 2003/0044717 (2003-03-01), Kodama
patent: 2003/0077540 (2003-04-01), Kodama et al.
patent: 2003/0186161 (2003-10-01), Fujimori et al.
patent: 2003/0203309 (2003-10-01), Nishimura et al.
patent: 2003/0219680 (2003-11-01), Nishimura et al.
patent: 227660 (1990-06-01), None
patent: 4226461 (1991-10-01), None
patent: 7234511 (1995-09-01), None

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