Radiation sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S921000, C430S922000, C430S919000, C430S925000, C430S905000, C430S910000, C430S326000

Reexamination Certificate

active

07078148

ABSTRACT:
A radiation-sensitive resin composition comprising: (A) a resin comprising a hydroxyl group or carboxyl group, of which the hydrogen atom has been replaced by an acid-dissociable group possessing an alkali dissolution controlling capability, the resin increasing the solubility in an alkaline aqueous solution when the acid-dissociable group dissociates, and a photoacid generator comprising (B-1) a sulfonium salt represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n-octanesulfonate and 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate and (B-2) a sulfonium salt represented by triphenylsulfonium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition useful as a novel chemically amplified resist exhibiting excellent sensitivity and resolution to deep ultraviolet rays typified by an ArF excimer laser, superior pattern shape-forming capability, and the like.

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patent: 6057080 (2000-05-01), Brunsvold et al.
patent: 6180316 (2001-01-01), Kajita et al.
patent: 6753124 (2004-06-01), Nishimura et al.
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patent: 2002/0009667 (2002-01-01), Nishimura et al.
patent: 2002/0132181 (2002-09-01), Nishimura et al.
patent: 2003/0203307 (2003-10-01), Soyano et al.
patent: 59-93448 (1984-05-01), None
patent: 5-188598 (1993-07-01), None

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