Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1998-03-11
2000-08-08
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430191, 430192, 430193, 4302701, 4302811, 430302, G03F 7021, G03F 0730
Patent
active
061000043
ABSTRACT:
A positive-working or negative-working radiation-sensitive mixture includes as an IR absorbing component a carbon black pigment having a primary particle size smaller than 80 nm. The carbon black pigment is predispersed in a polymer containing acidic units having a pK.sub.a of less than 13. The radiation-sensitive component may include an ester of (i) a 1,2-naphthoquinone-2-diazide-4-sulfonic acid or a 1,2-naphthoquinone-2-diazide-5-sulfonic acid and (ii) a compound having at least one phenolic hydroxyl group, such as 3 to 6 phenolic hydroxyl groups. After imagewise radiation exposure, the recording material including the radiation-sensitive mixture can be developed without difficulties in an aqueous alkaline solution without leaving residual coating on the areas that became soluble or that remained soluble upon exposure.
REFERENCES:
patent: 5658708 (1997-08-01), Kondo
patent: 5731123 (1998-03-01), Kawamura et al.
Eichhorn Mathias
Elsaesser Andreas
Gaschler Otfried
Grabley Fritz-Feo
Haberhauer Helmut
AGFA-GEVAERT N.V.
Chu John S.
LandOfFree
Radiation-sensitive mixture and recording material made thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation-sensitive mixture and recording material made thereof , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation-sensitive mixture and recording material made thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1148596