Radiation sensitive material and method for forming pattern

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S905000, C430S910000

Reexamination Certificate

active

10833114

ABSTRACT:
A copolymer expressed by the following structural formulawas obtained by loading adamantyl methacrylate monomer and t-butyl acrylate monomer by 1:1, then conducting polymerization, adding AIBN as a polymerization initiator, and then conducting precipitation purification with methanol. Then to the copolymer, triphenylsulfonium hexafluoroantimonate was added to prepare a cyclohexanone solution. This solution was applied to a wafer, and exposed to a KrF excimer stepper and developed. The threshold energy Eth was 50 mJ/cm2. A 0.45 μm-wide L & S was formed at 130 mJ/cm2. The radiation sensitive material has good transparency and etching resistance, high sensitivity, and little peeling.

REFERENCES:
patent: 3697280 (1972-10-01), Strilko
patent: 4828965 (1989-05-01), West et al.
patent: 4847327 (1989-07-01), Rupp et al.
patent: 5035979 (1991-07-01), Nguyen-Kim et al.
patent: 5071730 (1991-12-01), Allen et al.
patent: 5073474 (1991-12-01), Schwalm et al.
patent: 5077174 (1991-12-01), Bauer et al.
patent: 5102771 (1992-04-01), Vogel et al.
patent: 5230984 (1993-07-01), Tachiki et al.
patent: 5272042 (1993-12-01), Allen et al.
patent: 5279923 (1994-01-01), Hiro et al.
patent: 5310619 (1994-05-01), Crivello et al.
patent: 5360693 (1994-11-01), Sebald et al.
patent: 5372912 (1994-12-01), Allen et al.
patent: 5384229 (1995-01-01), Pai et al.
patent: 5399647 (1995-03-01), Nozaki et al.
patent: 5474872 (1995-12-01), Tomo et al.
patent: 5506088 (1996-04-01), Nozaki et al.
patent: 5563022 (1996-10-01), Binder et al.
patent: 5635332 (1997-06-01), Nakano et al.
patent: 5679495 (1997-10-01), Yamachika et al.
patent: 5738975 (1998-04-01), Nakano et al.
patent: 5851727 (1998-12-01), Choi et al.
patent: 6004720 (1999-12-01), Takechi et al.
patent: 6344304 (2002-02-01), Takechi et al.
patent: 6790589 (2004-09-01), Takechi et al.
patent: 0 366 590 (1990-05-01), None
patent: 0 476 865 (1992-03-01), None
patent: 0 487 261 (1992-05-01), None
patent: 0 516 427 (1992-12-01), None
patent: 0 544 465 (1993-06-01), None
patent: 574939 (1993-12-01), None
patent: 58-122533 (1983-07-01), None
patent: 62-40450 (1987-02-01), None
patent: 2-18564 (1990-01-01), None
patent: 2-209977 (1990-08-01), None
patent: 2-282746 (1990-11-01), None
patent: 3-192173 (1991-08-01), None
patent: 3-223864 (1991-10-01), None
patent: 3-223865 (1991-10-01), None
patent: 4-26850 (1992-01-01), None
patent: 4-39665 (1992-02-01), None
patent: 4-156548 (1992-05-01), None
patent: 4-211258 (1992-08-01), None
patent: 4-251259 (1992-09-01), None
patent: 4-321049 (1992-11-01), None
patent: 4-347857 (1992-12-01), None
patent: 5-17711 (1993-01-01), None
patent: 5-19479 (1993-01-01), None
patent: 5-39444 (1993-02-01), None
patent: 5-45881 (1993-02-01), None
patent: 5-72738 (1993-03-01), None
patent: 5-80516 (1993-04-01), None
patent: 5-152718 (1993-06-01), None
patent: 5-181279 (1993-07-01), None
patent: 5-216244 (1993-08-01), None
patent: 5-224422 (1993-09-01), None
patent: 5-232705 (1993-09-01), None
patent: 5-247386 (1993-09-01), None
patent: 5-249680 (1993-09-01), None
patent: 5-249682 (1993-09-01), None
patent: 5-257284 (1993-10-01), None
patent: 5-265212 (1993-10-01), None
patent: 5-265214 (1993-10-01), None
patent: 5-346668 (1993-12-01), None
patent: 7-28237 (1995-01-01), None
patent: 7-199467 (1995-08-01), None
Chemical Abstracts, vol. 116, No. 26, Jun. 29, 1992, “Deep UV top Surface Image Resist”, p. 693, col. 1.
International Publication No. WO 92/09934, published Jun. 11, 1992.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radiation sensitive material and method for forming pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation sensitive material and method for forming pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation sensitive material and method for forming pattern will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3848494

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.