Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-01-23
2007-01-23
Chapman, Mark A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S326000, C430S327000, C430S330000
Reexamination Certificate
active
11249813
ABSTRACT:
The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.
REFERENCES:
patent: 3779778 (1973-12-01), Smith et al.
patent: 4775609 (1988-10-01), McFarland
patent: 4810613 (1989-03-01), Osuch et al.
patent: 4931381 (1990-06-01), Spak et al.
patent: 4960950 (1990-10-01), Durvasula
patent: 5087547 (1992-02-01), Taylor et al.
patent: 5320931 (1994-06-01), Umehara et al.
patent: 5344748 (1994-09-01), Feely
patent: 5492793 (1996-02-01), Breyta et al.
patent: 5693609 (1997-12-01), Baker et al.
patent: 5879856 (1999-03-01), Thackeray et al.
patent: 5968712 (1999-10-01), Thackeray et al.
patent: 6300035 (2001-10-01), Thackeray et al.
patent: 6607870 (2003-08-01), Thackeray et al.
patent: 6727049 (2004-04-01), Thackeray et al.
patent: 6767688 (2004-07-01), Teng et al.
patent: 2003/0180657 (2003-09-01), Teng et al.
patent: 2003/0203310 (2003-10-01), Thackeray et al.
patent: 2003/0219603 (2003-11-01), Teng et al.
patent: 2003/0228474 (2003-12-01), Taylor et al.
patent: 2004/0161699 (2004-08-01), Thackeray et al.
patent: 0 211 350 (1987-02-01), None
patent: 0 292 821 (1988-11-01), None
patent: 0 412 457 (1991-02-01), None
patent: 0 419 147 (1991-03-01), None
Japanese Patent Application Laying Open (kokai) No. 2-296250, WPI Accession No. 91-031804 (Dec. 6, 1990).
Japanese Patent Application Laying Open (kokai) No. 1-300250 (Dec. 4, 1989).
Japanese Patent Application Laying Open (kokai) No. 2-118651 (May 2, 1990).
Japanese Patent Application Laying Open (kokai) No. 63-149640, WPI Accession No. 88-215340 (Dec. 12, 1986).
Japanese Patent Application Laying Open (kokai) No. 63-149639 (Jun. 22, 1988).
Japanese Patent Application Laying Open (kokai) No. 63-149638 (Jun. 22, 1988).
Japanese Patent Application Laying Open (kokai) No. 63-149637 (Jun. 22, 1988).
Japanese Patent Application Laying Open (kokai) No. 63-237053 (Oct. 3, 1988).
Japanese Patent Application No. 2-194147 [Laying Open (kokai) No. 4-80758] (Jul. 23, 1990).
Japanese Patent Application No. 2-159786 [Laying Open (kokai) No. 4-51243] (Jun. 20, 1990).
Japanese Patent Application No. 2-189209 [Laying Open (kokai) No. 4-75062] (Jul. 17, 1990).
Roberts et al., “Basic Principles of Organic Chemistry”, W.A. Benjamin, Inc., NY (1964), pp. 880-881.
R.C. Weast, ed. CRC Handbook of Chemistry & Physics, 52 ed., 1971-1972 Edition, p. D117.
CRC Handbook of Chemistry & Physics, 63rd Edition, (1982-1983), p. D172.
Lamola Angelo A.
Thackeray James W.
Chapman Mark A.
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Frickey Darryl P.
Shipley Company L.L.C.
LandOfFree
Radiation sensitive compositions and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation sensitive compositions and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation sensitive compositions and methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3782004