Radiation-resistance propylene polymer composition and radiation

Details Radiation-resistance propylene polymer composition and radiation Radiation-resistance propylene polymer composition and radiation

1993-05-10

1994-12-06

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524100, 524102, 524274, C08K 534

Patent

active

053711246

ABSTRACT:
Disclosed is a radiation resistant propylene polymer composition comprising a propylene polymer material and generally from about 0.1 to about 5 pph, of the propylene polymer material, of a rosin material. A hindered amine is present when the concentration of the rosin material is low, i.e., below 1.0 pph. At higher concentrations of rosin material, the hindered amine is optional. Radiation sterilized articles in which at least part of the material construction thereof comprises said radiation resistant propylene polymer composition are also disclosed.

REFERENCES:
patent: 3313754 (1967-04-01), Logan
patent: 3463752 (1969-08-01), Bornstein
patent: 3598776 (1971-08-01), Schirmer
patent: 4110185 (1979-08-01), Williams et al.
patent: 4274932 (1981-06-01), Williams et al.
patent: 4279659 (1981-07-01), Unmuth
patent: 4563259 (1986-01-01), Rayner
patent: 4710524 (1987-12-01), Donohue
patent: 4749734 (1988-06-01), Williams et al.
patent: 4797438 (1989-01-01), Kletecka et al.
patent: 4888369 (1989-12-01), Moore, Jr.
patent: 4888371 (1989-12-01), Tajima et al.
patent: 5041483 (1991-08-01), Burch

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