Radiation-hardening of SOI by ion implantation into the buried o

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Implanting to form insulator

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438407, 438473, H01L 2176

Patent

active

057958130

ABSTRACT:
The radiation hardness of a silicon-on-insulator structure is improved by planting dopant ions, such as Si, into the buried oxide layer. The dopant ions are implanted in the buried oxide layer, near, but not at, the active Si layer/buried oxide layer interface. This implantation creates electron traps/recombination centers in the buried oxide layer.

REFERENCES:
patent: 4749660 (1988-06-01), Short et al.
patent: 4766482 (1988-08-01), Smeltzer et al.
patent: 4806498 (1989-02-01), Fujii
patent: 4948742 (1990-08-01), Nishimura et al.
patent: 4997786 (1991-03-01), Kubota et al.
patent: 5360752 (1994-11-01), Brady et al.
patent: 5464792 (1995-11-01), Tseng et al.
patent: 5633174 (1997-05-01), Li

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radiation-hardening of SOI by ion implantation into the buried o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation-hardening of SOI by ion implantation into the buried o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation-hardening of SOI by ion implantation into the buried o will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1114308

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.