Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Implanting to form insulator
Patent
1998-08-13
2000-06-06
Bowers, Charles
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Implanting to form insulator
438407, 438473, 438DIG910, H01L 2176
Patent
active
060717912
ABSTRACT:
The radiation hardness of a microelectronic device is improved by implant dopant ions, such as Si, into an oxide layer. This implantation creates electron traps/recombination centers in the oxide layer. A subsequent anneal remove defects in the active silicon layer.
REFERENCES:
patent: 4775641 (1988-10-01), Duffy et al.
patent: 4804633 (1989-02-01), Macelwee et al.
patent: 4948742 (1990-08-01), Nishimura et al.
patent: 5338693 (1994-08-01), Kinzer et al.
patent: 5589708 (1996-12-01), Kalnitsky
patent: 5795813 (1998-08-01), Hughes et al.
Hughes Harold
McMarr Patrick
Bowers Charles
Delmendo Romulo H.
Edelberg Barry A.
Pert Evan
The United States of America as represented by the Secretary of
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