Radiation-curable composition useful for preparation of solder m

Details Radiation-curable composition useful for preparation of solder m Radiation-curable composition useful for preparation of solder m

1992-08-28

1994-03-22

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430311, 430325, 430330, G03C 1725

Patent

active

052963349

ABSTRACT:
A photosensitive composition for providing a solder mask on a printed circuit board is described, comprised of (a) an esterified styrene-maleic anhydride copolymer having less than 15%, most preferably less than 5%, free anhydride, with at least about 50% of the available anhydride groups being esterified with a hydroxyalkyl (meth)acrylate and at least about 0.1% of the available anhydride groups being esterified with a monohydric alcohol; (b) a multifunctional (meth)acrylate monomer; and (c) a multifunctional epoxide. The composition is coated on a printed circuit board, imagewise exposed to radiation to effect sufficient curing of the composition at exposed areas to enable removal of unexposed areas with developer, and post-baked after development to produce a desired patterned distribution of the cured composition to serve as a solder mask.

REFERENCES:
patent: 4722947 (1988-02-01), Thanawalla et al.
patent: 4745138 (1988-05-01), Thanawalla et al.
patent: 5114830 (1992-05-01), Surber

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