Radial epitaxial reactor for multiple wafer growth

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156611, 156612, 156613, 156614, C30B 2514

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active

052756866

ABSTRACT:
An improved gas distribution scheme for a multi-wafer radially injected convergent horizontal epitaxial reactor which includes two outer distribution rings, an outer injection ring, an annular susceptor, and a central exhaust tube. The converging path of the gas stream from the outer injection ring into the central exhaust tube compensates for depletion of the reactant gases along the substrate. The injector ring has a large number of evenly spaced diffuser orifices that allow the gas to expand into the growth chamber in a laminar flow pattern. The design is compact, includes the possibility of water cooling of the quartz during deposition, and allows for a resistive bakeout furnace which can be used to etch and clean the reaction chamber between runs.

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patent: 4649859 (1987-03-01), Wanlass
patent: 4907534 (1990-03-01), Huang et al.
patent: 4961399 (1990-10-01), Frijlink
patent: 5096534 (1992-03-01), Ozias

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