R-F Electrode type workholder and methods of supporting workpiec

Details R-F Electrode type workholder and methods of supporting workpiec R-F Electrode type workholder and methods of supporting workpiec

1982-12-23

1984-01-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118728, 118620, 156345, 204192R, 204192E, 204298, 427 39, 428336, 428627, 428698, B44C 122, C03C 1500, C03C 2506, C23C 1500

Patent

active

044240961

ABSTRACT:
Workpieces (11), such as semiconductor wafers, are treated in a plasma reaction apparatus (10). The wafers are loaded onto a workholder (18), where they become seated in contact with facing surfaces of a plurality of spaced, parallel plates (19, 21). Plasma is generated in each of the spaces (23) between two adjacent ones of the plates by coupling such adjacent plates to opposite terminals (31, 32) of an R-F generator (29). Each of the plates is comprised of a base structure (41) of a thermally stable, conductive material, such as graphite. The base structure is covered with a first layer (43) of a hard material, such as silicon carbide to impart wear resistance to the graphite. The layer (43), in turn, is covered by an outer, conductive layer (44) which, in the described embodiment is a layer of aluminum.

REFERENCES:
patent: 3980854 (1976-09-01), Berkman et al.
patent: 4073669 (1978-02-01), Heinecke et al.
patent: 4292153 (1981-09-01), Kudo et al.
patent: 4302498 (1981-11-01), Faith
patent: 4336304 (1982-06-01), Landingham et al.

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