Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1997-02-27
1999-09-07
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438121, 438123, H01L 2144, H01L 2148, H01L 2150
Patent
active
059500697
ABSTRACT:
A method of embedding a magnetically attractable member (25) in a ceramic material (1) and a system therefor wherein there are provided a magnetically attractable member and a ceramic member capable of being placed in a molten state. The magnetically attractable member is disposed over the ceramic member and the ceramic member is placed in a molten state. The magnetically attractable member is then disposed in the molten ceramic member by magnetic attraction and the molten ceramic member is then hardened around the magnetically attractable member. The magnetically attractable member is taken from the class consisting of Alloy 42 and Kovar. The ceramic member is preferably a glass. The ceramic member is preferably disposed on a semiconductor package and the magnetically attractable member is preferably at least a portion of a semiconductor lead frame.
REFERENCES:
patent: 4157611 (1979-06-01), Ohwaki et al.
patent: 5076204 (1991-12-01), Hisamune
patent: 5434450 (1995-07-01), Kozono
patent: 5776796 (1998-07-01), Destefano et al.
Brady III Wade James
Collins Devon
Donaldson Richard L.
Picardat Kevin M.
Texas Instruments Incorporated
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