Quartz resonator angle correction

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156643, 156654, 156663, 156345, 204192E, 204298, 219121LM, B44C 122, C03C 1500, C03C 2506

Patent

active

043892752

ABSTRACT:
This invention relates to the correction of the orientation angle or angle of cut of quartz crystal blanks which substantially eliminates the initial formation of mesas and the subsequent lapping operation, as heretofore required, by providing a controlled linear etching gradient across opposing faces of a crystal plate or blank which is to be corrected. A beam for either ion etching or photolytic etching is repeatedly scanned across the face of the crystal plate in a multi-line raster pattern under the control of a microprocessor or mini-computer which controls the contour of the face being etched. X-ray apparatus monitors the etching and feeds information back to the computing apparatus for providing a closed loop control. The scanning includes either intensity modulation or velocity modulation of the beam, or succeeding scan lines are repetitively scanned a greater number of times than the respective preceding lines causing increasing amounts of the surface to be eroded as the scanning operation proceeds.

REFERENCES:
patent: 3489564 (1970-01-01), Schaefer
patent: 3694677 (1972-09-01), Guttwein et al.
patent: 3803774 (1974-04-01), Miller
Proceedings of the 30th Annual Symposium on Frequency Control, (1976), pp. 59-263, "A Method of Angle Correction", D. Husgen et al.
Proceedings of 1980 IEEE Ultrasonics Symposium, "What Saw Can Learn From Baw . . . ", T. Lukaszek et al.

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