Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-04-25
2006-04-25
Chen, Wenpeng (Department: 2625)
Image analysis
Applications
Manufacturing or product inspection
C716S030000
Reexamination Certificate
active
07035446
ABSTRACT:
A method of measuring the quality of a simulated aerial image includes receiving as input a mask pattern for a chip design, simulating an aerial image of the mask pattern, calculating an error area representative of a deviation between an ideal boundary of the chip design and a boundary of the simulated aerial image, calculating maximum and average end-of-line deviations between the ideal boundary of the chip design and the boundary of the simulated aerial image, and displaying a worst quality area in the simulated aerial image as a function of the error area and the maximum and average end-of-line deviations for visual inspection.
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Aleshin Stanislav V.
Kalinin Jaroslav V.
Medvedeva Marina M.
Strelkova Nadya
Chen Wenpeng
Fitch Even Tabin & Flannery
LSI Logic Corporation
Shah Utpal
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