Quad flat pack integrated circuit package

Details Quad flat pack integrated circuit package Quad flat pack integrated circuit package

1998-10-26

1999-11-02

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 174 163, 257675, 257713, 257722, 361723, H05K 720

Patent

active

059782242

ABSTRACT:
A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element. The package may have a thermal element such as a clip or cover that is coupled to the tabs of adjacent integrated circuit packages.

REFERENCES:
patent: 3522490 (1970-08-01), Kauffman
patent: 3665256 (1972-05-01), Goun et al.
patent: 5444294 (1995-08-01), Suzuki
patent: 5566051 (1996-10-01), Burns
patent: 5659950 (1997-08-01), Adams et al.

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