Quad flat pack integrated circuit package

Details Quad flat pack integrated circuit package Quad flat pack integrated circuit package

1997-12-04

1999-02-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361723, 361704, 361707, 361717, 361718, 361722, 174 163, 165 802, 165 803, 257676, 257666, 257775, H05K 0118

Patent

active

058673679

ABSTRACT:
A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element.

REFERENCES:
patent: 5279029 (1994-01-01), Burns
patent: 5397746 (1995-03-01), Blish, II
patent: 5489801 (1996-02-01), Blish, II
patent: 5530284 (1996-06-01), Bailey
patent: 5646831 (1997-07-01), Manteghi

Affiliated with

Also associated with

Rating

Quad flat pack integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Quad flat pack integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Quad flat pack integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1123055