Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1978-12-29
1980-12-09
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 252 791, H01L 21306
Patent
active
042382750
ABSTRACT:
The invention is directed to a novel method for detecting surface damage to polished silicon wafers. For very fine defects and scratches an oxidation step is used. The oxide is removed and the wafer is treated in an etch solution containing pyrocatechol, ethylene diamine and water. The defects are detectable by the naked eye.
REFERENCES:
J. Electrochem. Soc.: Solid State Science, A Water-Amine-Complexing Agent System for Etching Silicon by R. M. Finne et al, Sep. 1967, pp. 965-970.
J. Electrochem. Soc.: Solid State Science, Substrate Surface Preparation and its Effect on Epitaxial Silicon by P. Rai-Chondhury, Jul. 1971, pp. 1183-1189.
IBM Technical Disclosure Bulletin, vol. 19, No. 9, Feb. 1977, Controlled Anisotropic Etching of Single Crystal Silicon by E. Bassous, pp. 3623-3624.
SCP and Solid State Technology, Slip and Bowing Control by Advanced Etching Techniques by Charles Wenzel, Aug. 1967, pp. 40-44.
International Business Machines - Corporation
McGee Hansel L.
Powell William A.
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