Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2006-10-06
2010-10-12
Van, Luan V (Department: 1795)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S225000
Reexamination Certificate
active
07811423
ABSTRACT:
A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a porous insert. The plating assembly also comprising a receiving unit having a fluid chamber and a metallic receiver. The receiving unit also has a porous insert. The porous insert of the delivery unit being substantially aligned with, and spaced apart from, the porous insert of the receiving unit. The metallic receiver being substantially aligned with the porous insert of the delivery unit and a path being defined between the delivery unit and the receiving unit. Wherein a plating meniscus is capable of being defined in the path between the porous inserts of the delivery unit and the receiving unit and a substrate is capable of being moved through the plating meniscus to enable the plating of metallic materials onto the surface of the substrate. Examples for de-plating are also provided.
REFERENCES:
patent: 7563348 (2009-07-01), Dordi et al.
Dordi Yezdi N.
Maraschin Robert
Woods Carl A.
Wylie Jacob
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Van Luan V
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